ASML unveils its first advanced packaging large-field exposure lithography machine

Jin10 Data, November 7th - At the 8th China International Import Expo, semiconductor equipment supplier ASML showcased some of its panoramic lithography products and technologies. Among them, the DUV lithography machines include the TWINSCAN XT:260 and TWINSCAN NXT:870B. The TWINSCAN XT:260, an i-line lithography machine, is ASML’s first lithography system designed for advanced packaging applications, featuring large field exposure and offering a fourfold increase in production efficiency compared to existing models. The TWINSCAN NXT:870B, supported by upgraded optical components and the latest generation magnetic levitation platform, can achieve a wafer throughput of over 400 wafers per hour (wph).