Bowei Alloy utilizes a "connection + heat dissipation" dual-engine approach to drive the upgrade of AI computing infrastructure.

Source: AI-generated

By 2026, the global AI industry will enter a critical period of deep implementation. The GTC conference revealed that AI computing power is shifting from a sole focus on chip performance competition to a comprehensive upgrade centered on system-level collaboration. As GPU architecture evolves and NVLink high-speed interconnection technology iterates, AI systems are accelerating toward large-scale clusters, with efficiency in computing power integration and scheduling facing higher power consumption and more complex system structure challenges. In this context, the stability of high-speed interconnects and the reliability of liquid cooling are becoming key factors affecting the PUE and computational efficiency of intelligent computing centers. As the foundational support for signal integrity, thermal management, and long-term reliability, materials are increasingly important. Boway Alloys provides high-performance copper alloy solutions to build a more efficient and stable AI computing foundation.

High-Speed AI Interconnect: Materials as the “Invisible Foundation” of Signal Transmission

In the field of high-speed AI interconnects, high bandwidth, low latency, and high-density connections are becoming mainstream development directions. With the continuous evolution of PCIe 5.0 and PCIe 6.0, and the accelerated deployment of 400G/800G optical modules, connectors face multiple challenges such as miniaturization, high insertion cycle life, low insertion loss, and high-temperature reliability. As signal rates reach 224Gbps and above, the microscopic consistency and stability of materials increasingly impact signal integrity.

Guided by AI large models for application development, Boway Alloys has launched material solutions tailored for high-speed interconnect scenarios: boway 19920 yields strength exceeds 1400MPa, maintaining good resistance to stress relaxation even under high temperature and long-term load environments. This effectively addresses contact force attenuation and signal stability issues caused by high-frequency plug-in and removal in high-density scenarios like GPU interconnects and memory modules, ensuring high-speed, lossless data transmission; boway 70318 achieves high strength (tensile strength over 940MPa) while also offering excellent forming performance (R/t ≤ 1.0), suitable for CPU sockets, high-speed I/O, and backplane connectors. These materials have been supplied in bulk and are continuously advancing in server interconnect applications.

Beyond Connectivity: Focus on Cooling — Materials as the “Dual Line” Operation

As GPU power consumption continues to rise, liquid cooling technology in AI servers is deepening from supplementary solutions to critical capabilities. The cooling solutions centered on cold plates are continuously evolving, with microchannel and other advanced technologies accelerating application. High-end intelligent computing centers demand higher thermal conductivity, density, and precision processing capabilities from materials. Boway Alloys’ AI server liquid cooling materials have completed validation with related liquid cooling plate manufacturers and are entering application deployment.

Through compositional design and process optimization, these materials have improved in complex structural processing, dimensional stability, and reliability under hot-cold cycles, helping to reduce structural failure and sealing risks under high pressure and thermal cycling conditions. They are suitable for key components such as liquid cooling pipe joints and cold plate encapsulation structures. Additionally, these materials work synergistically with high-speed interconnect materials, supporting stable operation of high-power-density systems from both “connection + cooling” perspectives, helping optimize data center energy efficiency. The company continues to optimize material formulations and is developing ultra-high thermal conductivity copper-based composites, reserving core material capabilities for next-generation liquid cooling technology upgrades.

From “Laggard” to “Runner-up”: Innovation Breakthroughs in Materials

The 2026 government work report proposes to deepen and expand “Artificial Intelligence +”, implementing ultra-large-scale intelligent computing clusters, computing-electrical synergy, and other new infrastructure projects. Under this trend, independent innovation and domestic upgrading of high-performance materials are becoming vital for supply chain security and competitiveness. Boway Alloys actively participates in front-end design with customers, optimizing from “materials-structure-process” collaboration to improve signal integrity from the source and reduce system failure risks. Facing the evolving demands brought by continuous development of AI large models, Boway Alloys will continue to drive technological innovation, supporting new heights in computing power with high-performance materials, and helping Chinese manufacturing move toward higher value chains.

About Boway Alloys

Founded in 1993, Boway Alloys was listed on the main board of the Shanghai Stock Exchange in 2011 (Stock code: 601137). The company specializes in new materials (alloy rods, wires, strips, and wires) and new energy. After more than 30 years of rapid development, it has established fourteen major manufacturing bases in China, Germany, Canada, Vietnam, and other countries. In 2019, the company fully promoted digital transformation, aiming to become a digital R&D and manufacturing enterprise characterized by “interconnected sharing and precise computing.”