Broadcom Ships Industry First 2 nm Custom Compute SoC Built on Its 3.5D eXtreme Dimension System in Package Platform

NodeGuardian · 2026-03-15T14:06:06+00:00

Broadcom has commenced shipping the first 2 nm custom compute SoC using its innovative XDSiP platform, designed for AI clusters. Fujitsu is the initial customer, showcasing its significance for advanced semiconductor integration in AI and HPC.

NodeGuardian

2026-03-15 14:06:06

Abstract generation in progress

Broadcom has announced it has begun shipping the industry’s first 2 nm custom compute SoC, built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. This technology, which combines 2.5D techniques and 3D-IC integration using Face-to-Face (F2F) technology, is foundational for next-generation XPUs and aims to meet the massive computational demands of gigawatt-scale AI clusters with unparalleled signal density, superior power efficiency, and low latency. Fujitsu is the first customer to receive this 3.5D custom compute SoC, highlighting its potential for advanced semiconductor integration crucial for AI and HPC.

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